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- Han, Sang Youn, et al. Show all 8 Authors
- Carbon 2019 v.149 pp. 656-663
- copper; copper nanoparticles; electrical conductivity; electrical resistance; electrodes; encapsulation; graphene; mechanical properties
- ... Recently, graphene has attracted much attention as a promising barrier material for Cu interconnection electrodes because of its excellent electrical, thermal, and mechanical properties and its ability to prevent the diffusion of Cu atoms. However, the effects of graphene on the electrical resistivity of graphene encapsulated Cu are still not fully understood. Here, we investigate the mechanism of ...