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- Teng, Kai-Wen; Tu, Sheng-Hung; Hu, Ssu-Wei; Huang, You-Xin; Sheng, Yu-Jane; Tsao, Heng-Kwong
- Journal of materials science 2020 v.55 no.3 pp. 1126-1135
- wafers, etc ; agitation; byproducts; chemical etching; computer hardware; manufacturing; mass transfer; phosphoric acid; silica; silicates; silicon nitride; water content; Show all 12 Subjects
- ... The Si₃N₄ layers in a 3D NAND flash patterned wafer are generally removed by hot phosphoric acid. However, the abnormal deposition of silicate which is the by-product from Si₃N₄ etching onto the neighboring SiO₂ layers will cause a serious problem in the subsequent process. In this work, the abnormal deposition phenomenon was investigated by a simple system containing a narrow gap (~ 80 μm) betwee ...