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Rapid Copper Metallization of Textile Materials: a Controlled Two-Step Route to Achieve User-Defined Patterns under Ambient Conditions

Author:
Zhang, Shuang-Yuan, Guan, Guijian, Jiang, Shan, Guo, Hongchen, Xia, Jing, Regulacio, Michelle D., Wu, Mingda, Shah, Kwok Wei, Dong, Zhili, Zhang, Jie, Han, Ming-Yong
Source:
ACS Applied Materials & Interfaces 2015 v.7 no.38 pp. 21545-21551
ISSN:
1944-8252
Subject:
bacteria, clothing, copper, cost effectiveness, cotton, electrical conductivity, electronics, fabrics, nylon, oxidation, polyesters, society, stainless steel, washing
Abstract:
Throughout history earth-abundant copper has been incorporated into textiles and it still caters to various needs in modern society. In this paper, we present a two-step copper metallization strategy to realize sequentially nondiffusive copper(II) patterning and rapid copper deposition on various textile materials, including cotton, polyester, nylon, and their mixtures. A new, cost-effective formulation is designed to minimize the copper pattern migration on textiles and to achieve user-defined copper patterns. The metallized copper is found to be very adhesive and stable against washing and oxidation. Furthermore, the copper-metallized textile exhibits excellent electrical conductivity that is ∼3 times better than that of stainless steel and also inhibits the growth of bacteria effectively. This new copper metallization approach holds great promise as a commercially viable method to metallize an insulating textile, opening up research avenues for wearable electronics and functional garments.
Agid:
5284318