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Puroindoline genes introduced into durum wheat reduce milling energy and change milling behavior similar to soft common wheats
- Heinze, K., Kiszonas, A.M., Murray, J.C., Morris, C.F., Lullien-Pellerin, V.
- Journal of cereal science 2016 v.71 pp. 183-189
- adhesion, aleurone layer, backcrossing, bran, chromosome translocation, durum wheat, endosperm, energy, flour, genes, mechanical properties, milling, particle size distribution, phytic acid, porosity, semolina, starch granules
- Grain physical characteristics and milling behavior of a durum wheat line in which both wild-type puroindoline genes were translocated and stabilized after backcrossing (Svevo-Pin) were compared with the parent line (Svevo). The only observed differences between grain characteristics were the mechanical resistance and starchy endosperm porosity revealed through vitreosity measurement. A significant increase of flour and a decrease of semolina yield and break milling energy were observed from Svevo-Pin in comparison with the non-recombinant parent line in accordance to the lower grain mechanical resistance and higher porosity measurements. Moreover, the particle size distribution shown for Svevo-Pin flour appeared consistent with a lower adhesion between starch granules and the protein matrix attributed to the presence of wild-type puroindolines. Coarse bran yield was conversely increased. This appeared to be due to a lower starchy endosperm recovery as a higher proportion of grain starch was found in this bran fraction. Flour from the durum parent line was inversely enriched in phytic acid, a cellular marker of the aleurone layer. Starch damage was also lower in Svevo-Pin flours in comparison with Svevo. All of the observed differences between translocation and parent lines were confirmed independent of the culture growth conditions (n = 12).