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Copper–SiC whiskers composites with interface optimized by Ti3SiC2

Author:
Li, Mian, Chen, Fanyan, Si, Xiaoyang, Wang, Ji, Du, Shiyu, Huang, Qing
Source:
Journal of materials science 2018 v.53 no.13 pp. 9806-9815
ISSN:
0022-2461
Subject:
coatings, copper, silicon carbide, tensile strength, thermal conductivity
Abstract:
In the present work, we propose Ti₃SiC₂ as the interlayer material to improve the interfacial bonding properties of SiC whiskers-reinforced copper matrix composites. For the first time, Ti₃SiC₂ coating was in situ fabricated on the surface of SiC whiskers in a molten salt bath. Ti₃SiC₂-coated SiC whiskers- and bare SiC whiskers-reinforced copper matrix composites were fabricated by spark plasma sintering. The influence of the Ti₃SiC₂ interlayer on the interfacial properties, mechanical properties, and thermal conductivity of the composites was investigated. The results show that the Ti₃SiC₂ interlayer can largely improve the interfacial bonding properties of the composites. Therefore, the composites reinforced with Ti₃SiC₂-coated SiC whiskers exhibit much higher tensile strength than the composites reinforced with bare SiC whiskers. The results also show that the Ti₃SiC₂ interlayer could decrease the thermal conductivity of the composites in certain extent.
Agid:
5932213