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Antimicrobial eugenol-loaded electrospun membranes of poly(ε-caprolactone)/gelatin incorporated with REDV for vascular graft applications B Biointerfaces
- Li, Zhenguang, Zhou, Peiqiong, Zhou, Fang, Zhao, Yunhui, Ren, Lixia, Yuan, Xiaoyan
- Colloids and surfaces 2018 v.162 pp. 335-344
- Escherichia coli, Staphylococcus aureus, adhesion, antibacterial properties, antibiotics, bacterial infections, cell viability, chemical bonding, colloids, cytotoxicity, endothelial cells, eugenol, fibroblasts, growth retardation, mechanical properties, molecular weight, risk
- Confronted with the risk of stenosis and bacterial infection, vascular grafts are necessarily required with rapid endothelialization and antibacterial activity. In this work, dual-functional electrospun membranes of poly(ε-caprolactone) (PCL)/gelatin were developed. A short active peptide, REDV, was covalently conjugated with a low molecular weight PCL to obtain REDV-PCL-REDV, which was introduced into the electrospun fibers to improve the adhesion and proliferation of vascular endothelial cells (VECs) on the electrospun membranes. Additionally, a plant-extracted antibacterial agent, eugenol, was loaded for the antibacterial purpose. Results suggested that the electrospun membranes demonstrated acceptable mechanical properties and release profiles. The electrospun membrane containing 30% of eugenol could inhibit Escherichia coli and Staphylococcus aureus with 71.6±3.3% and 78.6±2.5% of growth inhibition rates, respectively. Further results showed all the electrospun membranes exhibited lower cytotoxicity towards L929 fibroblasts with more than 80% of relative cell viability. The VEC culture assays indicated that the REDV-modified electrospun membranes by the incorporation of REDV-PCL-REDV could significantly promote VEC adhesion and proliferation. Therefore, the dual-functional electrospun membranes with endothelialization and antibacterial abilities by incorporating REDV and eugenol could be potentially applied as promising vascular grafts.