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Enhanced thermal conductivity of functionalized-graphene/boron nitride flexible laminated composite adhesive via a facile latex approach Part A Applied science and manufacturing
- Su, Zheng, Wang, Hua, Ye, Xianzhu, Tian, Konghu, Huang, Weiqi, Xiao, Chao, Tian, Xingyou
- Composites 2017 v.99 pp. 166-175
- Raman spectroscopy, X-ray diffraction, boron nitride, composite materials, hydrophilicity, industry, insulating materials, latex, polymers, scanning electron microscopy, thermal conductivity
- Flexible fiber-reinforced laminated composite adhesive combining with functionalized-graphene (f-G) layer and hexagonal boron nitride (h-BN) layer was prepared by colloid-blending and self-assembly technology with the assistance of the secondary force and hydrophilic difference. In this system, poly (2-ethylhexyl acrylate) (P2EHA) as the polymer matrix linked the layer of functionalized-graphene and another layer of hexagonal boron nitride like the cross-linker or adhesive via self-assembly technology. Lewis acid-base (δ⁺−δ⁻) interaction and π-π stacking improved the compatibility between the filler and the polymer matrix. The effective and successful fabrication of flexible f-G/h-BN laminated composite adhesive has been confirmed by SEM, Raman spectroscopy, and XRD investigations. The oriented stacking and laminated structure resulted in much higher in-plane thermal conductivities (∼4.20W/mK) and insulation in the direction through the plane and good adhesive properties. The procedure was environmental friendly, easy operation, and potential for the practical application in industry.