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The rheology and microstructure of composite wheat dough enriched with extruded mung bean flour

Author:
Meng, Yuejiao, Guan, Xiao, Liu, Xingli, Zhang, Hua
Source:
Lebensmittel-Wissenschaft + [i.e. und] Technologie 2019 v.109 pp. 378-386
ISSN:
0023-6438
Subject:
bean flour, crosslinking, dough, elastic deformation, loss modulus, microstructure, mixing, mung beans, pasting properties, retrogradation, rheology, staple foods, starch granules, storage modulus, water uptake, wheat, wheat flour
Abstract:
The study aimed to verify the potential of extruded mung bean flour (EMF) to improve the quality of mung–wheat composite dough for staple food making. The mung bean flour (MF) was extruded at 240 and 280 g/kg feed moisture with 200, 250, and 300 rpm screw speed before blending. The pasting characteristics of the extruded mung–wheat composite flour (EMWF), and the rheological properties and microstructure of the composite dough, were then evaluated. The addition of EMF significantly increased the water absorption and weakening degree of the dough, but it decreased dough stability. EMWF presented lower pasting profiles than native mung-wheat composite flour. Compared with those of control dough sample, the storage modulus (Gʹ) and loss modulus (G″) of the extruded mung–wheat composite dough (EMWD) significantly increased, but the creep compliance and the elastic deformation rate decreased, and the addition of EMF could inhibit the starch retrogradation in mung bean-wheat composite dough during the cooling process. According to microscopic structure of the dough samples, the network structure was formed by cross-linking between the starch granules of EMWD. In conclusion, EMF has the potential for addition to wheat flour for the production of staple food products.
Agid:
6365881